This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007
Title: Kuo-Ning Chiang: Innovator in Electronic Packaging Technology
Introduction
Kuo-Ning Chiang is a notable inventor based in Yangmei, Taiwan. He has made significant contributions to the field of electronic packaging technology. His innovative work has led to the development of a unique electronic package structure that enhances the efficiency and functionality of electronic devices.
Latest Patents
Kuo-Ning Chiang holds a patent for a "Three-dimensional multichip stack electronic package structure." This invention relates to a three-dimensional multichip stack electronic package structure and method for making the same. It includes a main substrate with at least a pin-hole set and a flexible substrate with at least a pin terminal. An electronic device, comprising both active and passive components, is attached to the flexible substrate by adhesion. The flexible substrate facilitates the delivery of electric signals from the electronic device to the pin terminal through conductive wires. During assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate, and the flexible substrate is folded to package the electronic device in a three-dimensional multichip stack manner. Kuo-Ning Chiang has 1 patent to his name.
Career Highlights
Kuo-Ning Chiang is associated with the Industrial Technology Research Institute, where he has been instrumental in advancing research and development in electronic packaging technologies. His work has garnered attention for its innovative approach and practical applications in the electronics industry.
Collaborations
Kuo-Ning Chiang has collaborated with notable colleagues, including Yung-Yu Hsu and Chang-An Yuan. Their combined expertise has contributed to the success of various projects within the field of electronic packaging.
Conclusion
Kuo-Ning Chiang's contributions to electronic packaging technology exemplify the spirit of innovation. His patent for a three-dimensional multichip stack electronic package structure showcases his commitment to enhancing electronic device functionality. His work continues to influence the industry and inspire future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile