The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2010
Filed:
Feb. 17, 2009
Yung-yu Hsu, Hsinchu, TW;
Rong-chang Feng, Hsinchu, TW;
Ra-min Tain, Hsinchu, TW;
Shyi-ching Liau, Hsinchu, TW;
Ji-cheng Lin, Hsinchu, TW;
Shan-pu Yu, Hsinchu, TW;
Shou-lung Chen, Hsinchu, TW;
Chih-yuan Cheng, Hsinchu, TW;
Yung-Yu Hsu, Hsinchu, TW;
Rong-Chang Feng, Hsinchu, TW;
Ra-Min Tain, Hsinchu, TW;
Shyi-Ching Liau, Hsinchu, TW;
Ji-Cheng Lin, Hsinchu, TW;
Shan-Pu Yu, Hsinchu, TW;
Shou-Lung Chen, Hsinchu, TW;
Chih-Yuan Cheng, Hsinchu, TW;
Industrial Technology Research Institute, Taiwan, CN;
Abstract
A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.