Location History:
- HsinChung, TW (2008)
- Taipei County, TW (2009)
- Hsinchu, TW (2009 - 2010)
- Sinjhuang, TW (2010)
- Hsinchu County, TW (2017 - 2021)
Company Filing History:
5 out of 198 
4 out of 9,157 
1 out of 6 Years Active: 2008-2021
Title: The Innovative Contributions of Ji-Cheng Lin
Introduction
Ji-Cheng Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on advanced manufacturing methods and structures that enhance the performance and reliability of electronic devices.
Latest Patents
Among his latest patents is a manufacturing method for a stacked chip package structure. This method involves several steps, including the placement of a first chip on a carrier, followed by the addition of a second chip that does not cover the first pads. The process includes forming stud bumps and pillar bumps, encapsulating the chips, and creating conductive vias through a laser process. Another notable patent describes a package structure that includes a die, conductive connectors, a redistribution layer, and a conductive shield, ensuring electrical insulation and enhanced functionality.
Career Highlights
Ji-Cheng Lin has worked with notable companies such as Powertech Technology Inc. and the Industrial Technology Research Institute. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations
Some of his coworkers include Li-Chih Fang and Che-Min Chu, who have collaborated with him on various projects, contributing to the advancement of semiconductor packaging technologies.
Conclusion
Ji-Cheng Lin's contributions to the field of semiconductor packaging are noteworthy, showcasing his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of manufacturing processes that are crucial for the future of electronic devices.