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Powertech Technology Inc.

USPTO Granted Patents = 198

Forward Citations = 626

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141 inventors (with patents filed for the assignee):

Hung-Hsin Hsu (70 out of 79 patents)

Nan-Chun Lin (48 out of 50 patents)

Wen-Jeng Fan (41 out of 41 patents)

4. Shang-Yu Chang Chien (40 out of 40 patents)

5. Li-Chih Fang (16 out of 16 patents)

6. Yong-Cheng Chuang (9 out of 9 patents)

7. Kuo-Ting Lin (9 out of 9 patents)

8. Chia-Wei Chang (9 out of 18 patents)

9. Chun-Te Lin (8 out of 10 patents)

10. Yu-Mei Hsu (7 out of 7 patents)

11. Chin-Fa Wang (7 out of 7 patents)

12. Kun-Yung Huang (6 out of 6 patents)

13. Chi-An Wang (6 out of 6 patents)

14. Che-Min Chu (6 out of 6 patents)

15. Chin-Ta Wu (5 out of 6 patents)

Core Competencies:

Fan-Out Package Structure

Image Sensing Device

Integrated Antenna Package

Semiconductor Packaging

Chip Carrier Device

Stacked Semiconductor Package

Bump Structure

Wafer Storage Device

Testing Device

Modular Stacked Package

Conductive Via

Multi-Chip Stack

198 patents: Sort by Forward Citations

1. 12477849 - Fan-out package structure of image sensing device and manufacturing method thereof (2025-11-18),

2. 12469833 - Package structure and manufacturing method thereof (2025-11-11),

3. 12400979 - Integrated antenna package structure and manufacturing method thereof (2025-08-26),

4. 12154863 - Fan-out semiconductor package and method for manufacturing the same (2024-11-26),

5. 12094809 - Chip-middle type fan-out panel-level package and packaging method thereof (2024-09-17),

6. 11990494 - Package structure and manufacturing method thereof (2024-05-21),

7. 11973037 - Package structure and manufacturing method thereof (2024-04-30),

8. 11916035 - Package structure and manufacturing method thereof (2024-02-27),

9. 11848318 - Package structure and manufacturing method thereof (2023-12-19),

10. 11769763 - Package structure and manufacturing method thereof (2023-09-26),

11. 11694950 - Semiconductor package (2023-07-04),

12. 11693043 - Test head assembly for semiconductor device (2023-07-04),

13. 11676983 - Sensor with dam structure and method for manufacturing the same (2023-06-13),

14. 11670622 - Stacked semiconductor package and packaging method thereof (2023-06-06),

15. 11670611 - Semiconductor package comprising plurality of bumps and fabricating method (2023-06-06),

Powertech Technology Inc. is a leading provider of integrated circuit (IC) backend services, specializing in assembly and testing solutions for memory, logic, and mixed-signal chips. With over 30 years of experience, Powertech has established itself as a trusted partner to global semiconductor companies, delivering high-quality, flexible, and cost-effective solutions. Their state-of-the-art facilities and advanced technologies enable them to meet the evolving needs of the semiconductor industry, maintaining their position as a leader in the market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

198 Patents

#1 in Hukou

#125 in Taiwan

#4,130 in the World

Powertech Technology Inc.

Forward Citations = 626

141 inventors:

Hung-Hsin Hsu (70 out of 79 patents)

Nan-Chun Lin (48 out of 50 patents)

Wen-Jeng Fan (41 out of 41 patents)

4. Shang-Yu Chang Chien (40 out of 40 patents)

5. Li-Chih Fang (16 out of 16 patents)

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