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Powertech Technology Inc.

USPTO Granted Patents = 207

% Expired Patents = 33.3

Forward Citations = 671

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145 inventors (with patents filed for the assignee):

Hung-Hsin Hsu (72 out of 82 patents)

Nan-Chun Lin (50 out of 52 patents)

Shang-Yu Chang Chien (44 out of 45 patents)

4. Wen-Jeng Fan (41 out of 41 patents)

5. Li-Chih Fang (16 out of 16 patents)

6. Yong-Cheng Chuang (9 out of 9 patents)

7. Kuo-Ting Lin (9 out of 9 patents)

8. Chia-Wei Chang (9 out of 19 patents)

9. Chun-Te Lin (8 out of 10 patents)

10. Kun-Yung Huang (7 out of 7 patents)

11. Yu-Mei Hsu (7 out of 7 patents)

12. Chin-Fa Wang (7 out of 7 patents)

13. Chi-An Wang (6 out of 6 patents)

14. Che-Min Chu (6 out of 6 patents)

15. Chin-Ta Wu (5 out of 6 patents)

Core Competencies:

Semiconductor Packaging

Chip Structure

Image Sensor Package

Fan-Out Package

Integrated Antenna

Manufacturing Method

Stacked Package

Conductive Element

Wafer Storage

Testing Device

Bump Structure

Modular Package

207 patents: Sort by Forward Citations

1. 12740168 - Image sensor and packaging thereof (2026-09-15),

2. 12642146 - Package structure having multiple redistribution layers and manufacturing method thereof (2026-05-26),

3. 12604785 - Package structure and manufacturing method thereof (2026-04-14),

4. 12599014 - Package device and manufacturing method thereof (2026-04-07),

5. 12563848 - Image sensor package (2026-02-24),

6. 12557692 - Semiconductor packaging assembly and semiconductor packaging structure (2026-02-17),

7. 12538847 - Package structure and manufacturing method thereof (2026-01-27),

8. 12507495 - Image sensor package with low light-sensing noise (2025-12-23),

9. 12506101 - Chip structure, semiconductor package, and fabricating method thereof (2025-12-23),

10. 12477849 - Fan-out package structure of image sensing device and manufacturing method thereof (2025-11-18),

11. 12469833 - Package structure and manufacturing method thereof (2025-11-11),

12. 12400979 - Integrated antenna package structure and manufacturing method thereof (2025-08-26),

13. 12154863 - Fan-out semiconductor package and method for manufacturing the same (2024-11-26),

14. 12094809 - Chip-middle type fan-out panel-level package and packaging method thereof (2024-09-17),

15. 11990494 - Package structure and manufacturing method thereof (2024-05-21),

Powertech Technology Inc. is a leading provider in the semiconductor packaging industry, headquartered in Hukou, Taiwan. The company specializes in advanced packaging solutions, focusing on innovative technologies such as chip structure, image sensor packages, and fan-out packages. Powertech is recognized for its expertise in integrated antenna designs, manufacturing methods, and stacked packages, which enhance the performance and efficiency of semiconductor devices. Its commitment to research and development positions it at the forefront of semiconductor technology advancements.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

207 Patents

#1 in Hukou

#133 in Taiwan

#4,104 in the World

Powertech Technology Inc.

Forward Citations = 671

145 inventors:

Hung-Hsin Hsu (72 out of 82 patents)

Nan-Chun Lin (50 out of 52 patents)

Shang-Yu Chang Chien (44 out of 45 patents)

4. Wen-Jeng Fan (41 out of 41 patents)

5. Li-Chih Fang (16 out of 16 patents)

Please report any incorrect information to [email protected]

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