The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Jun. 14, 2022
Applicant:
Powertech Technology Inc., Hukou, TW;
Inventors:
Kun-Yung Huang, Hukou, TW;
Jen-I Huang, Hukou, TW;
Assignee:
Powertech Technology Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3192 (2013.01); H01L 24/05 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/0239 (2013.01);
Abstract
A semiconductor packaging assembly includes a redistribution layered structure having a plurality of device regions and a plurality of cutting regions separating the device regions, a plurality of recess structures respectively formed in the cutting regions, a plurality of chips respectively disposed in the device regions, and an encapsulating layer formed on the redistribution layered structure to fill the recess structures and enclose the chips.