Jen-I Huang

Title: The Innovations of Jen-I Huang

Introduction

Jen-I Huang is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his expertise and innovative spirit. His work primarily focuses on semiconductor package structures and their manufacturing methods.

Latest Patents

One of Jen-I Huang's latest patents is titled "Semiconductor package structure with landing pads and manufacturing method thereof." This invention describes a semiconductor package structure that includes a first redistribution layer, conductive connectors, a chip, and an encapsulant. The first redistribution layer features a conductive pattern with landing pads, which are electrically connected to the chip. The encapsulant serves to protect the chip and connectors, ensuring the integrity of the semiconductor package.

Another notable patent is the "Fan-out semiconductor package structure and fabricating method." This invention involves a fan-out semiconductor package that utilizes a layer of adhesive on a temporary carrier. The first redistribution layer includes a metal layer with recessed areas, where metal pillars are plated. A semiconductor chip is bonded to the recessed areas, and a molding compound covers the chip. This innovative approach enhances the performance and reliability of semiconductor packages.

Career Highlights

Jen-I Huang is currently employed at Powertech Technology Inc., a leading company in the semiconductor industry. His work at Powertech has allowed him to develop cutting-edge technologies that contribute to advancements in semiconductor packaging. His patents reflect his commitment to innovation and excellence in his field.

Collaborations

Throughout his career, Jen-I Huang has collaborated with talented individuals such as Ching-Yang Chen and Jeffrey Wang. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies in semiconductor packaging.

Conclusion

Jen-I Huang's contributions to semiconductor technology through his innovative patents demonstrate his expertise and dedication to the field. His work at Powertech Technology Inc. and collaborations with fellow inventors highlight the importance of teamwork in driving technological advancements. His inventions continue to shape the future of semiconductor packaging.