Hsinchu, Taiwan

Kun-Yung Huang

This inventor holds 7 USPTO granted patents and 4 published patent applications. Top assignee: Powertech Technology Inc.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun-Yung Huang. Retrieved from https://idiyas.com/inventor/kun-yung-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 85.7

Average Co-Inventor Count = 2.2

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2019-2026

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7 patents (USPTO):Explore Patents

Title: Innovator Kun-Yung Huang: Pioneering Semiconductor Solutions

Introduction

Kun-Yung Huang is a prominent inventor based in Hsinchu County, Taiwan. His contributions to the field of semiconductor technology have resulted in an impressive portfolio of six patents. Huang's innovative work plays a significant role in advancing semiconductor packaging, which is crucial for modern electronic devices.

Latest Patents

Among his latest inventions, Huang has developed a semiconductor package structure with landing pads and a manufacturing method thereof. This innovative semiconductor package structure comprises a first redistribution layer featuring a first and second surface, conductive connectors, a chip, and an encapsulant. The first redistribution layer incorporates at least one conductive pattern and a dielectric layer stacked together. The conductive pattern includes multiple landing pads, each isolated from the dielectric layer. Additionally, Huang's semiconductor package invention includes a semiconductor die, encapsulant, redistribution layer, polymer pattern, and a heat dissipation structure, highlighting his technical expertise in creating efficient semiconductor solutions.

Career Highlights

Kun-Yung Huang is currently associated with Powertech Technology Inc., where he continues to make strides in semiconductor technology. His work has not only pushed the boundaries of product design but has also contributed significantly to the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

During his career, Huang has collaborated with talented professionals such as Chi-Liang Pan and Jing-Hua Cheng. These partnerships have fostered a creative environment that enhances innovation and allows for the development of cutting-edge semiconductor technologies.

Conclusion

Kun-Yung Huang's dedication to innovation in semiconductor packaging showcases his vital role in the electronics industry. With his numerous patents and collaborative efforts, he continues to inspire future generations of inventors in the ever-evolving world of technology. His impactful inventions exemplify the critical nature of effective semiconductor solutions in today's electronic landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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