The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
May. 15, 2019
Powertech Technology Inc., Hsinchu County, TW;
Kun-Yung Huang, Hsinchu County, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a semiconductor die, an encapsulant, a redistribution layer, a polymer pattern and a heat dissipation structure. The semiconductor die has conductive pads at its active side, and is laterally encapsulated by the encapsulant. The redistribution layer is disposed at the active side of the semiconductor die, and spans over a front surface of the encapsulant. The redistribution layer is electrically connected with the conductive pads. The polymer pattern is disposed at a back surface of the encapsulant that is facing away from the front surface of the encapsulant. The semiconductor die is surrounded by the polymer pattern. The heat dissipation structure is in contact with a back side of the semiconductor die that is facing away from the active side, and extends onto the polymer pattern.