The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jun. 18, 2017
Powertech Technology Inc., Hsinchu County, TW;
Kun-Yung Huang, Hsinchu County, TW;
Chih-Fu Lung, Hsinchu County, TW;
Shih-Chi Li, Hsinchu County, TW;
Mei-Chen Lee, Hsinchu County, TW;
Chung-Hao Tsai, Hsinchu County, TW;
Chi-Liang Wang, Hsinchu County, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
A manufacturing method of a redistribution layer is provided. The method includes the following steps. A patterned sacrificial layer is formed on a carrier. An actuate angle is formed between a side wall of the patterned sacrificial layer and the carrier. A first conductive layer is formed. The first conductive layer includes a plurality of first portions formed on the carrier and a plurality of second portions formed on the patterned sacrificial layer. The patterned sacrificial layer and the second portions of the first conductive layer are removed from the carrier. Another manufacturing method of a redistribution layer is also provided.