Company Filing History:
Years Active: 2020
Title: Innovations of Shih-Chi Li in Redistribution Layer Manufacturing
Introduction
Shih-Chi Li is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of manufacturing methods, particularly in the development of redistribution layers. His innovative approach has led to the creation of a patented method that enhances the efficiency and effectiveness of electronic component manufacturing.
Latest Patents
Shih-Chi Li holds a patent for a manufacturing method of a redistribution layer. This method involves several key steps, including the formation of a patterned sacrificial layer on a carrier, creating an acute angle between the side wall of the patterned sacrificial layer and the carrier, and the formation of a first conductive layer. The first conductive layer consists of multiple first portions on the carrier and second portions on the patterned sacrificial layer. The process concludes with the removal of the patterned sacrificial layer and the second portions of the first conductive layer from the carrier.
Career Highlights
Li is currently employed at Powertech Technology Inc., where he continues to innovate in the field of semiconductor manufacturing. His work has been instrumental in advancing the technology used in electronic devices, making them more efficient and reliable.
Collaborations
Shih-Chi Li collaborates with talented individuals in his field, including Kun-Yung Huang and Chih-Fu Lung. Their combined expertise contributes to the ongoing development of innovative manufacturing techniques.
Conclusion
Shih-Chi Li's contributions to the manufacturing methods of redistribution layers exemplify the impact of innovation in technology. His patent and work at Powertech Technology Inc. highlight the importance of collaboration and creativity in advancing the semiconductor industry.