The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jan. 26, 2018
Powertech Technology Inc., Hsinchu County, TW;
Ming-Yi Wang, Hsinchu County, TW;
Kun-Yung Huang, Hsinchu County, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
An encapsulating composition and a semiconductor package are provided. The encapsulating composition adapted to encapsulate a semiconductor die includes a photosensitive dielectric material and a polarizable compound suspended in the photosensitive dielectric material. The polarizable compound within a predetermined region of the encapsulating composition affected by an external stimulus is arranged uniformly in a thickness direction to provide a conductive path penetrating through the photosensitive dielectric material along the thickness direction. The semiconductor package includes the encapsulating composition encapsulating the semiconductor die, a first and a second redistribution layer. The first and the second redistribution layer disposed on the opposite sides of the encapsulating composition are electrically connected each other through the encapsulating composition. A manufacturing method of the semiconductor package is also provided.