The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2026
Filed:
Dec. 19, 2022
Powertech Technology Inc., Hsinchu County, TW;
Shang-Yu Chang Chien, Hsinchu County, TW;
POWERTECH TECHNOLOGY INC., Hsinchu County, TW;
Abstract
A package structure and a manufacturing method thereof are provided. The package structure includes a redistribution layer, a conductive pillar, an active chip, an encapsulation layer, and another redistribution layer. The conductive pillar and the active chip are side by side disposed on the redistribution layer. The encapsulation layer surrounds the active chip and the conductive pillar, in which the encapsulation layer has a first through hole disposed between the active chip and the redistribution layer and a second through hole disposed between the conductive pillar and the redistribution layer, and a depth of the first through hole is less than a depth of the second through hole. The another redistribution layer is disposed on a side of the redistribution layer away from the redistribution layer and electrically connected to the redistribution layer through the conductive pillar.