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For the Inventor, By the Inventor

Hsinchu County, Taiwan

Nan-Chun Lin

USPTO Granted Patents = 50 

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 102(Granted Patents)

Forward Citations (Not Self Cited) = 103(Oct 12, 2025)


Location History:

  • Hukou Township, Hsinchu County, TW (2012 - 2023)
  • Hsinchu County, TW (2018 - 2024)

Company Filing History:

goldMedal48 out of 198 
 
Powertech Technology Inc.
 patents
silverMedal2 out of 7 
 
Adl Engineering Inc.
 patents

Years Active: 2012-2025

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Areas of Expertise:
Integrated Antenna Package
Fan-Out Semiconductor Package
Semiconductor Package Structure
Chip Package Structure
Conductive Via
Conductive Pillar
Three-Dimensional Packaging
Silicon Interposer
Encapsulant Manufacturing
Testing Method
Redistribution Layer
Multi-Layer Structure
50 patents (USPTO):Explore Patents
1. 12400979 - Integrated antenna package structure and manufacturing method thereof (2025-08-26),
2. 12154863 - Fan-out semiconductor package and method for manufacturing the same (2024-11-26),
3. 11973037 - Package structure and manufacturing method thereof (2024-04-30),
4. 11916035 - Package structure and manufacturing method thereof (2024-02-27),
5. 11769763 - Package structure and manufacturing method thereof (2023-09-26),
6. 11670611 - Semiconductor package comprising plurality of bumps and fabricating method (2023-06-06),
7. 11637071 - Package structure including multiple dies surrounded by conductive element and manufacturing method thereof (2023-04-25),
8. 11569210 - Package structure having a first connection circuit and manufacturing method thereof (2023-01-31),
9. 11557533 - Package structure and manufacturing method thereof (2023-01-17),
10. 11545424 - Package structure and manufacturing method thereof (2023-01-03),
11. 11545423 - Package structure and manufacturing method thereof (2023-01-03),
12. 11532575 - Integrated antenna package structure and manufacturing method thereof (2022-12-20),
13. 11456243 - Semiconductor package structure and manufacturing method thereof (2022-09-27),
14. 11367678 - Package structure and manufacturing method thereof (2022-06-21),
15. 11309296 - Semiconductor package and manufacturing method thereof (2022-04-19),

Title: The Innovative Journey of Inventor Nan-Chun Lin

Introduction: Nan-Chun Lin, a pioneering inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Nan-Chun Lin holds several patents in the field of semiconductor technology, including patents related to advanced chip design and manufacturing processes.

Career Highlights: With a career spanning over two decades, Nan-Chun Lin has worked tirelessly to push the boundaries of technological advancement. He has held key positions in leading tech companies, where he played a crucial role in developing cutting-edge technologies.

Collaborations: Throughout his career, Nan-Chun Lin has collaborated with top researchers, engineers, and scientists in the industry to drive innovation forward. His collaborative efforts have led to the development of revolutionary products and solutions.

Conclusion: Nan-Chun Lin's passion for innovation and his relentless pursuit of excellence have solidified his position as a respected figure in the world of technology. His contributions continue to inspire future generations of inventors and innovators to push the boundaries of what is possible.

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