The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Jul. 26, 2021
Powertech Technology Inc., Hsinchu County, TW;
Shang-Yu Chang Chien, Hsinchu County, TW;
Nan-Chun Lin, Hsinchu County, TW;
Hung-Hsin Hsu, Hsinchu County, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
A package structure including a first die, an encapsulant, a first circuit structure, a second circuit structure, a conductive connector, a second die, and a filler is provided. The encapsulant covers the first die and has a first surface and a second surface opposite to each other. The first circuit structure is disposed on the first surface. The second circuit structure is disposed on the second surface. The conductive connector penetrates the encapsulant. The second die is disposed on the second circuit structure. The second die has an optical signal transmission area. The filler is disposed between the second die and the second circuit structure. An upper surface of the second circuit structure has a groove. The upper surface includes a first area and a second area disposed on opposite sides of the groove. The filler directly contacts the first area. The filler is disposed away from the second area.