The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Oct. 27, 2020
Powertech Technology Inc., Hsinchu County, TW;
Hung-Hsin Hsu, Hsinchu County, TW;
Nan-Chun Lin, Hsinchu County, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
A package structure including a redistribution circuit structure, a first chip, a second chip, a first circuit board, a second circuit board, and a plurality of conductive terminals is provided. The redistribution circuit structure has a first connection surface and a second connection surface opposite to the first connection surface. The first chip and the second chip are disposed on the first connection surface and are electrically connected to the redistribution circuit structure. The first circuit board and the second circuit board are disposed on the second connection surface and are electrically connected to the redistribution circuit structure. The conductive terminals are disposed on the first circuit board or the second circuit board. The conductive terminals are electrically connected to the first circuit board or the second circuit board. A manufacturing method of a package structure is also provided.