The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Nov. 30, 2022
Applicant:

Powertech Technology Inc., Hsinchu County, TW;

Inventors:

Shang-Yu Chang Chien, Hsinchu County, TW;

Nan-Chun Lin, Hsinchu County, TW;

Hung-Hsin Hsu, Hsinchu County, TW;

Assignee:

Powertech Technology Inc., Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/561 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Provided is an integrated antenna package structure including a chip, a circuit structure, a shielding body, an encapsulant, a first antenna layer, a dielectric body, and a second antenna layer. The circuit structure is electrically connected to the chip. The shielding body is disposed on the circuit structure and has an accommodating space. The chip is disposed in the accommodating space of the shielding body. The encapsulant is disposed on the circuit structure and covers the chip. The first antenna layer is disposed on the circuit structure and is electrically connected to the circuit structure. The dielectric body is disposed on the encapsulant. The second antenna layer is disposed on the dielectric body. A manufacturing method of the integrated antenna package structure is also provided.


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