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For the Inventor, By the Inventor

Hsinchu County, Taiwan

Li-Chih Fang

USPTO Granted Patents = 16 

Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 62(Granted Patents)


Location History:

  • Hsinchu, TW (2009 - 2017)
  • Hsinchu County, TW (2017 - 2021)

Company Filing History:

goldMedal16 out of 198 
 
Powertech Technology Inc.
 patents

Years Active: 2009-2021

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16 patents (USPTO):Explore Patents
1. 10950557 - Stacked chip package structure and manufacturing method thereof (2021-03-16),
2. 10840200 - Manufacturing method of chip package structure comprising encapsulant having concave surface (2020-11-17),
3. 10607860 - Package structure and chip structure (2020-03-31),
4. 10593629 - Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof (2020-03-17),
5. 10431549 - Semiconductor package and manufacturing method thereof (2019-10-01),
6. 10276510 - Manufacturing method of package structure having conductive shield (2019-04-30),
7. 10163834 - Chip package structure comprising encapsulant having concave surface (2018-12-25),
8. 9972554 - Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof (2018-05-15),
9. 9831219 - Manufacturing method of package structure (2017-11-28),
10. 9825010 - Stacked chip package structure and manufacturing method thereof (2017-11-21),
11. 9761568 - Thin fan-out multi-chip stacked packages and the method for manufacturing the same (2017-09-12),
12. 9659911 - Package structure and manufacturing method thereof (2017-05-23),
13. 8304917 - Multi-chip stacked package and its mother chip to save interposer (2012-11-06),
14. 7927919 - Semiconductor packaging method to save interposer (2011-04-19),
15. 7691676 - Mold array process for semiconductor packages (2010-04-06),

Title: **Innovations by Li-Chih Fang: Pioneering Chip Package Structures**

Introduction

Li-Chih Fang, an accomplished inventor based in Hsinchu County, Taiwan, has marked his presence in the field of semiconductor packaging with an impressive portfolio of 16 patents. His inventions contribute significantly to the advancement of chip package structures, enhancing performance and efficiency in the electronics industry.

Latest Patents

Among his notable inventions, Li-Chih Fang’s latest patents include a manufacturing method for a stacked chip package structure. This innovative method encompasses a detailed process wherein a first chip is positioned on a carrier, allowing for intricate connectivity through various stud and pillar bumps, followed by encapsulation with special materials that expose critical contact points. Another significant patent focuses on a manufacturing method for a chip package structure designed with a concave encapsulant surface. It details the steps of dicing a wafer, utilizing adhesive layers for chip mounting, and implementing dielectric layers to create efficient electrical connections, which showcases Fang’s commitment to innovation in chip packaging.

Career Highlights

Li-Chih Fang currently works at Powertech Technology Inc., a leading company in the semiconductor industry. His expertise in developing innovative manufacturing methods has transformed chip packaging processes, aligning with the fast-evolving technology landscape.

Collaborations

Throughout his career, Li-Chih Fang has worked alongside talented colleagues, including Wen-Jeng Fan and Ji-Cheng Lin. These collaborations have undoubtedly spurred creativity and innovation within their projects, contributing to the advancement of semiconductor technology.

Conclusion

Li-Chih Fang's contributions to the field of semiconductor packaging represent a significant leap forward in innovation. His patents reflect a deep understanding of technology and a commitment to improving manufacturing methods, ensuring that the industry continues to evolve and meet the demands of modern electronics. Fang's work at Powertech Technology Inc. underscores the importance of inventors in shaping the future of technological advancements.

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