The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Nov. 14, 2008
Wen-jeng Fan, Hsinchu, TW;
Li-chih Fang, Hsinchu, TW;
Ji-cheng Lin, Hsinchu, TW;
Powertech Technology Inc., Hsinchu, TW;
Abstract
A mold array process (MAP) for manufacturing a plurality of semiconductor packages is revealed. Firstly, a substrate strip including a plurality of substrate units arranged in an array within a molding area is provided. A plurality of chips are disposed on the substrate units. An encapsulant by molding is formed on the molding area of the substrate strip to continuously encapsulate the chips. During the molding process, an adjustable top mold is implemented where a cavity width between two opposing sidewalls inside a top mold chest can be adjusted to make the mold flow speeds at the center and at the side rails of the molding area the same.