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For the Inventor, By the Inventor

Hsinchu, Taiwan

Wen-Jeng Fan

USPTO Granted Patents = 41 

Average Co-Inventor Count = 1.3

ph-index = 6

Forward Citations = 239(Granted Patents)


Location History:

  • Hsinchu, TW (2009 - 2014)
  • Hsinchu County, TW (2016 - 2022)

Company Filing History:

goldMedal41 out of 198 
 
Powertech Technology Inc.
 patents

Years Active: 2009-2022

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Areas of Expertise:
Semiconductor Packaging
Conductive Via
Heat Dissipation
Electromagnetic Interference
Multi-Chip Stacked Package
Wafer Level Packaging
Leadframe Package
Package-On-Package
Chip-On-Lead
Substrate Panel
Wire-Bonding
Ball Grid Array
41 patents (USPTO):Explore Patents
1. 11257747 - Semiconductor package with conductive via in encapsulation connecting to conductive element (2022-02-22),
2. 10593629 - Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof (2020-03-17),
3. 10431549 - Semiconductor package and manufacturing method thereof (2019-10-01),
4. 9991248 - Method and device of pop stacking for preventing bridging of interposer solder balls (2018-06-05),
5. 9859233 - Semiconductor device package with reinforced redistribution layer (2018-01-02),
6. 9853015 - Semiconductor device with stacking chips (2017-12-26),
7. 9837385 - Substrate-less package structure (2017-12-05),
8. 9324651 - Package structure (2016-04-26),
9. 8853834 - Leadframe-type semiconductor package having EMI shielding layer connected to ground (2014-10-07),
10. 8541870 - Semiconductor package utilizing tape to reinforce fixing of leads to die pad (2013-09-24),
11. 8420437 - Method for forming an EMI shielding layer on all surfaces of a semiconductor package (2013-04-16),
12. 8304917 - Multi-chip stacked package and its mother chip to save interposer (2012-11-06),
13. 8299587 - Lead frame package structure for side-by-side disposed chips (2012-10-30),
14. 8240029 - Method for forming an isolated inner lead from a leadframe (2012-08-14),
15. 8053676 - Substrate panel having a plurality of substrate strips for semiconductor packages (2011-11-08),

Title: Innovator Spotlight: Wen-Jeng Fan from Hsinchu, Taiwan

Introduction

Wen-Jeng Fan is a prominent inventor hailing from Hsinchu, Taiwan. With an impressive portfolio of 41 patents, he has made significant contributions to the field of semiconductor packaging solutions. His innovations are pivotal in enhancing the functionality and efficiency of semiconductor devices.

Latest Patents

Wen-Jeng Fan’s recent patents showcase advanced technology that addresses both heat dissipation and electromagnetic interference (EMI) shielding in semiconductor packages. One noteworthy patent details a semiconductor package featuring a conductive via in encapsulation that connects to a conductive element. This design optimizes space by ensuring that the height of the conductive element is less than that of the semiconductor chip while maintaining effective electrical coupling.

Another key patent involves a semiconductor package with a conductive casing specifically designed for heat dissipation and EMI shielding. This innovation includes a semiconductor die embedded within a cavity of the conductive casing, along with a redistribution structure that enhances its electrical connectivity. These improvements not only streamline the manufacturing process but also bolster the performance of the semiconductor package.

Career Highlights

Wen-Jeng Fan is currently associated with Powertech Technology Inc., where he leverages his expertise in semiconductor technology. His career is marked by a commitment to research and development, leading to numerous impactful inventions in the industry.

Collaborations

Throughout his career, Wen-Jeng has collaborated closely with colleagues such as Li-Chih Fang and Yu-Mei Hsu. These partnerships have allowed for a synergy of ideas and innovations, driving forward advancements in semiconductor technology within their company.

Conclusion

Wen-Jeng Fan stands out as a significant figure in the semiconductor industry, with a robust portfolio of patents that reflect his dedication to innovation. His work continues to influence the development of advanced semiconductor packaging solutions, making notable strides in both efficiency and performance.

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