The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Dec. 25, 2016
Applicant:
Powertech Technology Inc., Hsinchu County, TW;
Inventor:
Wen-Jeng Fan, Hsinchu County, TW;
Assignee:
POWERTECH TECHNOLOGY INC., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 24/17 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02317 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/17104 (2013.01);
Abstract
A semiconductor device package includes an encapsulation layer, a die, at least one trace stiffener, and a redistribution layer. The encapsulation layer has an opening. The die is disposed in the opening of the encapsulation layer. The redistribution layer is formed above the die and the encapsulation layer. The least one trace stiffener are formed on the redistribution layer above boundaries of the encapsulation layer and the die for reinforcing a structure of the redistribution layer above the boundaries of the encapsulation layer and the die.