The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Dec. 13, 2012
Powertech Technology Inc., Hsinchu, TW;
Powertech Technology Inc., Hsinchu, TW;
Abstract
Disclosed is a leadframe-type semiconductor package having an EMI shielding layer connected to ground, comprising a leadframe, a chip, an encapsulant, and an EMI shielding layer. The encapsulant has two lead-extending sides and two leadless sides. The EMI shielding layer covers at least one surface of the encapsulant and the leadless sides. A metal tie bar coupling to the die attach pad of the leadframe has a cut end aligned with and exposed on one of the leadless sides. A ground lead also has a cut end aligned with and exposed on one of the leadless sides Since the EMI shielding layer covers and electrically connects the cut ends of the metal tie bar and the ground lead, the die pad with its metal tie bar of the leadframe is connected to the ground lead through external electrical connection outside the encapsulant to allow the die pad having ground potential.