Hsinchu County, Taiwan

Chun-Te Lin

USPTO Granted Patents = 10 

Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Hsinchu County, TW (2017 - 2021)
  • Hsinchu, TW (2004 - 2022)
  • Hukou Township, Hsinchu County, TW (2022)
  • Hukou Township, TW (2023)

Company Filing History:


Years Active: 2004-2023

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10 patents (USPTO):Explore Patents

Title: Innovations by Inventor Chun-Te Lin

Introduction

Chun-Te Lin, an accomplished inventor based in Hsinchu County, Taiwan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 10 patents, he has established himself as a leading figure in innovation, particularly in semiconductor packaging and bump structures.

Latest Patents

Chun-Te Lin's recent patents focus on advancements in semiconductor packaging. One of his notable inventions is a semiconductor package that comprises a substrate, a chip, and an encapsulation. This innovative design features a dielectric layer, a copper wiring layer, and a solder resist layer, ensuring durability and reliability. The design includes an annular opening that reduces concentration stress, thereby averting potential cracks during thermal-cycle tests.

Additionally, he has developed a bump structure for semiconductor packages that incorporates a metal layer and a first dielectric layer. This invention includes an under bump metallurgy (UBM), a first buffer layer, and a metal bump, effectively absorbing thermal stress to prevent cracks in the bump structure post-bonding.

Career Highlights

Chun-Te Lin has been instrumental in advancing technology through his work in prominent companies such as Powertech Technology Inc. and Mosel Vitelic Corporation. His tenure at these organizations has undoubtedly contributed to his extensive understanding of semiconductor technologies and their practical applications.

Collaborations

Throughout his career, Chun-Te Lin has collaborated with notable colleagues, including Li-Chih Fang and Ji-Cheng Lin. These collaborations have enriched his inventions and fostered a culture of innovation within the semiconductor industry.

Conclusion

With a strong foundation in semiconductor technology and a wealth of experience, Chun-Te Lin continues to make strides in the field through his inventions and patents. His work not only enhances semiconductor packaging and bump structures but also paves the way for future innovations within the industry.

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