The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Aug. 07, 2020
Applicant:
Powertech Technology Inc., Hsinchu, TW;
Inventors:
Tsung-Han Chiang, Hsinchu, TW;
Chun-Te Lin, Hsinchu, TW;
Assignee:
Powertech Technology Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01);
Abstract
A method for packaging a semiconductor device includes the steps of: disposing a wafer on a first carrier plate; attaching a second carrier plate to a side of the first carrier plate opposite to the wafer; disposing a chip unit on a side of the wafer opposite to the first carrier plate; and covering the wafer and the chip unit with an encapsulation layer. A semiconductor packaging structure is also disclosed.