The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2008
Filed:
Mar. 10, 2006
Ji-cheng Lin, HsinChung, TW;
Yao-sheng Lin, Chiayi, TW;
Shyh-ming Chang, Hsinchu, TW;
Su-tsai LU, Tongluo Township, Miaoli County, TW;
Hsien-chie Cheng, Taichung, TW;
Tai-hong Chen, Sijhih, TW;
Ji-Cheng Lin, HsinChung, TW;
Yao-Sheng Lin, Chiayi, TW;
Shyh-Ming Chang, Hsinchu, TW;
Su-Tsai Lu, Tongluo Township, Miaoli County, TW;
Hsien-Chie Cheng, Taichung, TW;
Tai-Hong Chen, Sijhih, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A composite bump suitable for disposing on a substrate pad is provided. The composite bump includes a compliant body and an outer conductive layer. The coefficient of thermal expansion (CTE) of the compliant body is between 5 ppm/° C. and 200 ppm/° C. The outer conductive layer covers the compliant body and is electrically connected to the pad. The compliant body can provide a stress buffering effect for a bonding operation. Furthermore, by setting of the CTE of the compliant body within a preferable range, damages caused by thermal stress are reduced while the bonding effect is enhanced.