Tai-Hong Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic assembly and circuit substrates. With a total of 8 patents to his name, Chen's work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is titled "Electronic assembly having a multilayer adhesive structure." This invention involves an electronic device that comprises a substrate and several bump units over the substrate. Each bump unit includes an electrically insulating bump-forming body extending in a first direction, along with at least two conductive layers that are separated from each other and extend in a second direction orthogonal to the first direction.

Another notable patent is "Circuit substrate and method for utilizing packaging of the circuit substrate." This patent provides a circuit substrate and a method for fabricating its packaging. A plurality of electrodes are formed on the surface of the circuit substrate, featuring fork structures over a connection section. This design enhances the alignment probability with external circuit boards, effectively eliminating electrode misalignment due to thermal deformation.

Career Highlights

Tai-Hong Chen is currently associated with the Industrial Technology Research Institute, where he continues to innovate and develop new technologies. His work has been instrumental in advancing electronic assembly techniques and improving circuit substrate designs.

Collaborations

Some of his notable coworkers include Yao-Sheng Lin and Shyh-Ming Chang, who have collaborated with him on various projects and patents.

Conclusion

Tai-Hong Chen's contributions to the field of electronics through his patents and innovations demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future developments.

Profile summary based on public USPTO records.

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