The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Jul. 26, 2010
Yao-sheng Lin, Hsinchu Hsien, TW;
Tai-hong Chen, Hsinchu Hsien, TW;
Yao-Sheng Lin, Hsinchu Hsien, TW;
Tai-Hong Chen, Hsinchu Hsien, TW;
Industrial Technology Research Institute, Hsinchu Hsien, TW;
Abstract
A circuit substrate and the method for fabricating a packaging of the circuit substrate are provided. A plurality of electrodes are formed on the surface of the circuit substrate, the electrodes are formed with fork structures over an connection section of the circuit substrate, so that when the circuit substrate expands/contracts due to thermal processes, the probability of alignment with electrodes of an external circuit board is increased by easily detaching the fork structure overlapping an electrode of the external circuit board which is not corresponding to the fork structure of the electrode of the circuit substrate, so as to avoid short circuit. Thus, electrode misalignment due to electrode pitch variation of the traditional circuit substrate as a result of thermal deformation can be effectively eliminated.