Location History:
- Taoyeng, TW (2008 - 2009)
- Hsinchu, TW (2006 - 2010)
- Chiayi, TW (2007 - 2017)
Company Filing History:
Years Active: 2006-2017
Title: Innovations by Shan-Pu Yu in Semiconductor Technology
Introduction
Shan-Pu Yu is a distinguished inventor based in Chiayi, Taiwan, recognized for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 13 patents, he has been influential in developing advanced methods and structures that enhance the performance and efficiency of semiconductor devices.
Latest Patents
Shan-Pu Yu's latest innovations include two noteworthy patents focused on wafer-leveled chip packaging. The first patent, titled "Electrically Stackable Semiconductor Wafer and Chip Packages," outlines a comprehensive wafer-level chip packaging method. This method involves several steps: providing a wafer, attaching at least one chip, forming insulating layers, and establishing conductive vias that create electrical connections among various components.
The second patent, "Wafer Leveled Chip Packaging Structure and Method Thereof," describes a similar wafer-leveled packaging process. This methodology utilizes conductive vias and insulating materials to create a robust structure that enhances electrical connectivity and efficiency within semiconductor applications.
Career Highlights
Throughout his career, Shan-Pu Yu has worked with notable institutions, contributing his expertise to the Industrial Technology Research Institute and Adeia Semiconductor Bonding Technologies Inc. His work in these companies has propelled advancements in semiconductor technology and has fostered a deeper understanding of chip packaging processes.
Collaborations
During his career, Shan-Pu Yu has collaborated with esteemed colleagues, including Shou-Lung Chen and Jyh-Rong Lin. These partnerships have facilitated the exchange of ideas and methodologies, further enhancing the innovation landscape within the semiconductor industry.
Conclusion
Shan-Pu Yu stands out as a pivotal inventor in semiconductor technology. His patents not only showcase his innovative spirit but also underscore his commitment to advancing technology in the industry. With continued research and development, Yu's contributions are sure to inspire future innovations in semiconductor packaging and beyond.