The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Feb. 19, 2004
Applicants:
Shou-lung Chen, Hsinchu, TW;
Fang-jun Leu, Hsinchu, TW;
I-hsuan Peng, Hsinchu, TW;
Shan-pu Yu, Hsinchu, TW;
Inventors:
Shou-Lung Chen, Hsinchu, TW;
Fang-Jun Leu, Hsinchu, TW;
I-Hsuan Peng, Hsinchu, TW;
Shan-Pu Yu, Hsinchu, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stacked package for electronic elements is provided, a plurality of stud bumps are formed on a substrate by means of a stud bump process to align with a plurality of vias of one provided electronic element. The stud bumps respectively pass through the vias and electrically connect the electronic element. Furthermore, additional electronic elements are stacked on the carrier according to a similar way to form a stacked electronic package.