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For the Inventor, By the Inventor

Hsinchu, Taiwan

Fang-Jun Leu

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.2

ph-index = 5

Forward Citations = 89(Granted Patents)


Location History:

  • Taipei, TW (2020)
  • Hsinchu, TW (1993 - 2021)

Company Filing History:

goldMedal9 out of 9,138 
 
Industrial Technology Research Institute
 patents
silverMedal1 out of 1 
 
Win-house Electronic Co., Ltd.
 patent
where one patent can have more than one assignee

Years Active: 1993-2021

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9 patents (USPTO):
1. 11114387 - Electronic packaging structure (2021-09-07),
2. 10672677 - Semiconductor package structure (2020-06-02),
3. 7572676 - Packaging structure and method of an image sensor module (2009-08-11),
4. 7544529 - Image sensor packaging structure and method of manufacturing the same (2009-06-09),
5. 7417293 - Image sensor packaging structure (2008-08-26),
6. 7411306 - Packaging structure and method of an image sensor module (2008-08-12),
7. 7091592 - Stacked package for electronic elements and packaging method thereof (2006-08-15),
8. 6166435 - Flip-chip ball grid array package with a heat slug (2000-12-26),
9. 5243493 - Fanless convection cooling design for personal computers (1993-09-07),

Title: Innovations of Fang-Jun Leu

Introduction

Fang-Jun Leu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic packaging and semiconductor technology. With a total of 9 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

Fang-Jun Leu's latest patents include an innovative electronic packaging structure. This structure features a substrate, a conductive layer, and an intermetallic compound, along with a stress buffering material and an electronic device. The design ensures that the intermetallic compound is strategically placed to enhance the performance and reliability of the electronic device. Another notable patent is a semiconductor package structure that incorporates a semiconductor chip, a guard ring, a gel layer, and a first lead frame. This design optimizes the connection between the semiconductor chip and the lead frame, improving overall functionality.

Career Highlights

Throughout his career, Fang-Jun Leu has worked with esteemed organizations such as the Industrial Technology Research Institute and Win-house Electronic Co., Ltd. His experience in these companies has allowed him to develop and refine his innovative ideas in electronic packaging and semiconductor technologies.

Collaborations

Fang-Jun Leu has collaborated with notable colleagues, including Shou-Lung Chen and Shan-Pu Yu. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Fang-Jun Leu's contributions to electronic packaging and semiconductor technology are noteworthy. His innovative patents and collaborations reflect his dedication to advancing the field. His work continues to influence the industry and inspire future innovations.

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