The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
May. 14, 2018
Industrial Technology Research Institute, Hsinchu, TW;
Win-house Electronic Co., Ltd., New Taipei, TW;
Jing-Yao Chang, New Taipei, TW;
Tao-Chih Chang, Taoyuan, TW;
Kuo-Shu Kao, Hsinchu, TW;
Fang-Jun Leu, Taipei, TW;
Hsin-Han Lin, Zhudong Township, Hsinchu County, TW;
Chih-Ming Tzeng, Hsinchu, TW;
Hsiao-Ming Chang, New Taipei, TW;
Chih-Ming Shen, New Taipei, TW;
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
WIN-HOUSE ELECTRONIC CO., LTD., New Taipei, TW;
Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.