IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Chih-Ming Shen

USPTO Granted Patents = 12

Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 19(Granted Patents)


Location History:

  • Hsinchu, TW (2019)
  • New Taipei, TW (2015 - 2022)

Company Filing History:

goldMedal12 out of 9,138 
 
Industrial Technology Research Institute
 patents
silverMedal1 out of 1 
 
Win-house Electronic Co., Ltd.
 patent
where one patent can have more than one assignee

Years Active: 2015-2022

where 'Filed Patents' based on already Granted Patents

12 patents (USPTO):
1. 11363724 - Fabrication method of flexible electronic package device (2022-06-14),
2. 11239146 - Package structure (2022-02-01),
3. 11132786 - Board defect filtering method based on defect list and circuit layout image and device thereof and computer-readable recording medium (2021-09-28),
4. 10672677 - Semiconductor package structure (2020-06-02),
5. 10540474 - Chip temperature computation method and chip temperature computation device (2020-01-21),
6. 10343868 - Roller with pressure sensor and R to R device (2019-07-09),
7. 10288696 - Intelligent diagnosis system for power module and method thereof (2019-05-14),
8. 10197255 - Rail-type OLED lamp assembly (2019-02-05),
9. 10037980 - Fabricating method of a semiconductor light emitting device (2018-07-31),
10. 9721931 - Semiconductor light emitting device and fabricating method thereof (2017-08-01),
11. 9647029 - Light-emitting device and manufacturing method of a display (2017-05-09),
12. 9157843 - Testing method of bending stress and testing apparatus thereof (2015-10-13),

Title: Chih-Ming Shen: Innovator in Flexible Electronic Packaging

Introduction

Chih-Ming Shen is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of flexible electronic packaging, holding a total of 12 patents. His innovative work has paved the way for advancements in electronic device fabrication.

Latest Patents

One of his latest patents is a fabrication method of a flexible electronic package device. This method includes steps to achieve a tolerable bending radius for the device, ensuring that the bending radius is smaller than the minimum surface curvature radius of the applied carrier. Another notable patent is a package structure that features a substrate and a hybrid pad. This hybrid pad consists of a metal layer and a buffer layer, with the Young's modulus of the buffer layer being less than that of the metal layer. The package structure also includes an electrically connecting structure and a chip layer, enhancing the functionality of electronic devices.

Career Highlights

Chih-Ming Shen has worked with esteemed organizations such as the Industrial Technology Research Institute and Win-house Electronic Co., Ltd. His experience in these companies has contributed to his expertise in electronic packaging technologies.

Collaborations

He has collaborated with notable coworkers, including Tao-Chih Chang and Ming-Ji Dai, further enriching his professional journey.

Conclusion

Chih-Ming Shen's innovative contributions to flexible electronic packaging demonstrate his commitment to advancing technology in this field. His patents reflect a deep understanding of the complexities involved in electronic device fabrication.

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