Chih-Ming Shen is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of flexible electronic packaging, holding a total of 12 patents. His innovative work has paved the way for advancements in electronic device fabrication.

Latest Patents

One of his latest patents is a fabrication method of a flexible electronic package device. This method includes steps to achieve a tolerable bending radius for the device, ensuring that the bending radius is smaller than the minimum surface curvature radius of the applied carrier. Another notable patent is a package structure that features a substrate and a hybrid pad. This hybrid pad consists of a metal layer and a buffer layer, with the Young's modulus of the buffer layer being less than that of the metal layer. The package structure also includes an electrically connecting structure and a chip layer, enhancing the functionality of electronic devices.

Career Highlights

Chih-Ming Shen has worked with esteemed organizations such as the Industrial Technology Research Institute and Win-house Electronic Co., Ltd. His experience in these companies has contributed to his expertise in electronic packaging technologies.

Collaborations

He has collaborated with notable coworkers, including Tao-Chih Chang and Ming-Ji Dai, further enriching his professional journey.

Conclusion

Chih-Ming Shen's innovative contributions to flexible electronic packaging demonstrate his commitment to advancing technology in this field. His patents reflect a deep understanding of the complexities involved in electronic device fabrication.

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