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For the Inventor, By the Inventor

Taoyuan, Taiwan

Tao-Chih Chang

This inventor holds 31 USPTO granted patents and 10 published patent applications, primarily in Chip Packaging. Top assignees: Industrial Technology Research Institute, Diodes Taiwan S.a R.l., Icp Technology Co., Ltd.. Active years: 2012-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tao-Chih Chang. Retrieved from https://idiyas.com/inventor/tao-chih-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 93.5

Average Co-Inventor Count = 3.3

ph-index = 4

Forward Citations = 50(Granted Patents)


Location History:

  • Longtan Township, Taoyuan County, TW (2013)
  • Taoyuan County, TW (2012 - 2016)
  • Hsinchu, TW (2020 - 2021)
  • Taoyuan, TW (2017 - 2023)

Company Filing History:

goldMedal31 out of 9,303 
 
Industrial Technology Research Institute
 patents
silverMedal1 out of 1 
 
Diodes Taiwan S.a R.l.
 patent
bronzeMedal1 out of 4 
 
Icp Technology Co., Ltd.
 patents
4. 1 out of 521 
 
Unimicron Technology Corporation
 patents
5. 1 out of 1 
 
Win-House Electronic Co., Ltd.
 patent
where one patent can have more than one assignee

Years Active: 2012-2023

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Areas of Expertise:
Chip Package
Semiconductor Package
Electronic Packaging
Power Module
Light-Emitting Device
Micro-Bump Structure
Ceramic Substrate
Hetero-Integrated Structure
Signal Transmission Board
Stacked Structure
Bump Structure
Composite System Board
31 patents (USPTO):Explore Patents
1. 11854961 - Package substrate and method of fabricating the same and chip package structure (2023-12-26),
2. 11776867 - Chip package (2023-10-03),
3. 11756858 - Power module with housing having bending sections (2023-09-12),
4. 11538842 - Chip scale package structures (2022-12-27),
5. 11387159 - Chip package (2022-07-12),
6. 11355472 - Package structure and method for connecting components (2022-06-07),
7. 11239211 - Electronic device having a curved portion between a plurality of conductive portions on a substrate (2022-02-01),
8. 11239168 - Chip package structure (2022-02-01),
9. 11114387 - Electronic packaging structure (2021-09-07),
10. 11004816 - Hetero-integrated structure (2021-05-11),
11. 10784297 - Chip scale package structures (2020-09-22),
12. 10743411 - Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component (2020-08-11),
13. 10672677 - Semiconductor package structure (2020-06-02),
14. 10622274 - Chip package (2020-04-14),
15. 10490478 - Chip packaging and composite system board (2019-11-26),

Title: The Innovative Journey of Inventor Tao-Chih Chang

Introduction: Tao-Chih Chang, a distinguished inventor hailing from Taoyuan, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Chang's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Tao-Chih Chang has established himself as a pioneer in the tech industry, holding numerous patents that have revolutionized various sectors. His commitment to pushing the boundaries of innovation has earned him recognition as a visionary inventor.

Collaborations: Throughout his career, Chang has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the development of groundbreaking technologies that have had a lasting impact on society.

Conclusion: Inventor Tao-Chih Chang's relentless pursuit of innovation and his passion for creating technologies that shape the future make him a true trailblazer in the world of inventions. His work continues to inspire the next generation of inventors and serves as a testament to the power of human ingenuity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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