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Taoyuan, Taiwan

Unimicron Technology Corporation

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USPTO Granted Patents = 523

% Expired Patents = 19.9

EPO Patents = 13

Trademarks = 1

Forward Citations = 1,193

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315 inventors (with patents filed for the assignee):

Tzyy-Jang Tseng (92 out of 95 patents)

Cheng-Ta Ko (52 out of 63 patents)

Pu-Ju Lin (42 out of 42 patents)

4. Cheng-Po Yu (39 out of 40 patents)

5. Ra-Min Tain (37 out of 37 patents)

6. Kai-Ming Yang (37 out of 38 patents)

7. Shih-Ping Hsu (34 out of 164 patents)

8. Yu-Hua Chen (33 out of 56 patents)

9. Tsung-Yuan Chen (32 out of 32 patents)

10. Dyi-Chung Hu (31 out of 107 patents)

11. Chun-Hsien Chien (27 out of 28 patents)

12. Shih-Lian Cheng (24 out of 24 patents)

13. Ming-Hao Wu (24 out of 24 patents)

14. Shu-Sheng Chiang (24 out of 24 patents)

15. Chin-Sheng Wang (21 out of 32 patents)

Core Competencies:

Circuit Board

Manufacturing Method

Electronic Packaging

Substrate Structure

Integrated Circuit

Light Emitting Diode

Co-Packaged Structure

Probe Card

Flexible Circuit

Heat Dissipation

Build-Up Layers

Optical Signal

523 patents: Sort by Forward Citations

1. 12777581 - Circuit board structure and manufacturing method thereof (2026-10-27),

2. 12772385 - Circuit board structure and manufacturing method thereof (2026-10-20),

3. 12757334 - Circuit board structure and manufacturing method thereof (2026-10-06),

4. 12739976 - Embedded inductor structure and manufacturing method thereof (2026-09-15),

5. 12739969 - Collapse-free circuit structure with low capacitance effect (2026-09-15),

6. 12727517 - Chip package structure and manufacturing method thereof (2026-09-01),

7. 12690141 - Wiring board structure (2026-07-21),

8. 12666992 - Circuit board with embedded chip and method of manufacturing the same (2026-06-23),

9. 12652752 - Circuit board device (2026-06-09),

10. 12645041 - Package structure (2026-06-02),

11. 12638247 - Vapor chamber structure and manufacturing method thereof (2026-05-26),

12. 12628671 - Substrate structure and manufacturing method thereof (2026-05-12),

13. 12628656 - Electronic packaging structure and manufacturing method thereof (2026-05-12),

14. 12625330 - Package structure and manufacturing method thereof (2026-05-12),

15. 12621933 - Capacitive element, circuit carrier having the same and fabrication method thereof (2026-05-05),

Company Overview

Unimicron Technology Corporation, headquartered in Taoyuan, Taiwan, specializes in the manufacturing of advanced circuit boards and electronic packaging solutions. The company focuses on developing innovative substrate structures that support integrated circuits and light-emitting diodes, catering to the evolving needs of the electronics industry. With expertise in co-packaged structures and probe card technologies, Unimicron plays a crucial role in enhancing the performance and reliability of electronic devices across various applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 10 2026

523 Patents

#7 in Taoyuan

#59 in Taiwan

#1,860 in the World

Taoyuan, Taiwan

Unimicron Technology Corporation

Forward Citations = 1,193

315 inventors:

Tzyy-Jang Tseng (92 out of 95 patents)

Cheng-Ta Ko (52 out of 63 patents)

Pu-Ju Lin (42 out of 42 patents)

4. Cheng-Po Yu (39 out of 40 patents)

5. Ra-Min Tain (37 out of 37 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Unimicron Technology Corporation. Retrieved from https://idiyas.com/company/unimicron-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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