For the Inventor, By the Inventor

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Taoyuan, Taiwan

Unimicron Technology Corporation

USPTO Granted Patents = 520

% Expired Patents = 20.0

EPO Patents = 13

Trademarks = 1

Forward Citations = 1,176

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315 inventors (with patents filed for the assignee):

Tzyy-Jang Tseng (92 out of 95 patents)

Cheng-Ta Ko (51 out of 62 patents)

Pu-Ju Lin (41 out of 41 patents)

4. Cheng-Po Yu (39 out of 40 patents)

5. Ra-Min Tain (36 out of 36 patents)

6. Kai-Ming Yang (36 out of 37 patents)

7. Shih-Ping Hsu (34 out of 164 patents)

8. Yu-Hua Chen (33 out of 56 patents)

9. Tsung-Yuan Chen (32 out of 32 patents)

10. Dyi-Chung Hu (31 out of 107 patents)

11. Chun-Hsien Chien (27 out of 28 patents)

12. Ming-Hao Wu (24 out of 24 patents)

13. Shu-Sheng Chiang (24 out of 24 patents)

14. Shih-Lian Cheng (23 out of 23 patents)

15. John Hon-Shing Lau (20 out of 20 patents)

Core Competencies:

Circuit Board

Manufacturing Method

Electronic Packaging

Substrate Structure

Integrated Circuit

Light Emitting Diode

Co-Packaged Structure

Probe Card

Flexible Circuit

Heat Dissipation

Build-Up Layers

Optical Signal

520 patents: Sort by Forward Citations

1. 12739976 - Embedded inductor structure and manufacturing method thereof (2026-09-15),

2. 12739969 - Collapse-free circuit structure with low capacitance effect (2026-09-15),

3. 12727517 - Chip package structure and manufacturing method thereof (2026-09-01),

4. 12690141 - Wiring board structure (2026-07-21),

5. 12666992 - Circuit board with embedded chip and method of manufacturing the same (2026-06-23),

6. 12652752 - Circuit board device (2026-06-09),

7. 12645041 - Package structure (2026-06-02),

8. 12638247 - Vapor chamber structure and manufacturing method thereof (2026-05-26),

9. 12628671 - Substrate structure and manufacturing method thereof (2026-05-12),

10. 12628656 - Electronic packaging structure and manufacturing method thereof (2026-05-12),

11. 12625330 - Package structure and manufacturing method thereof (2026-05-12),

12. 12621933 - Capacitive element, circuit carrier having the same and fabrication method thereof (2026-05-05),

13. 12588135 - Method of manufacturing circuit board (2026-03-24),

14. 12568810 - Anti-diffusion substrate structure and manufacturing method thereof (2026-03-03),

15. 12563668 - Circuit board, manufacturing method thereof, and electronic device (2026-02-24),

Unimicron Technology Corporation is a Taiwanese electronic component manufacturing company. It specializes in the production of printed circuit boards (PCBs) for various industries including telecommunications, automotive, consumer electronics, and more. With over 30 years of experience, Unimicron is known for its advanced technologies, excellent quality control, and efficient production processes. The company is committed to delivering reliable and innovative PCB solutions to meet the evolving needs of its customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

Unimicron Technology Corporation

520 Patents

#8 in Taoyuan

#60 in Taiwan

#1,875 in the World

Taoyuan, Taiwan

Unimicron Technology Corporation

Forward Citations = 1,176

315 inventors:

Tzyy-Jang Tseng (92 out of 95 patents)

Cheng-Ta Ko (51 out of 62 patents)

Pu-Ju Lin (41 out of 41 patents)

4. Cheng-Po Yu (39 out of 40 patents)

5. Ra-Min Tain (36 out of 36 patents)

Please report any incorrect information to [email protected]

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