For the Inventor, By the Inventor

Enter assignee name

Taoyuan, Taiwan

Unimicron Technology Corporation

USPTO Granted Patents = 499

EPO Patents = 13

Trademarks = 1

Forward Citations = 1,129

Loading Chart...

Loading Chart...

302 inventors (with patents filed for the assignee):

Tzyy-Jang Tseng (88 out of 91 patents)

Cheng-Ta Ko (46 out of 57 patents)

Cheng-Po Yu (39 out of 40 patents)

4. Pu-Ju Lin (37 out of 37 patents)

5. Kai-Ming Yang (35 out of 36 patents)

6. Shih-Ping Hsu (34 out of 164 patents)

7. Ra-Min Tain (32 out of 32 patents)

8. Yu-Hua Chen (32 out of 55 patents)

9. Tsung-Yuan Chen (32 out of 32 patents)

10. Dyi-Chung Hu (31 out of 107 patents)

11. Chun-Hsien Chien (27 out of 28 patents)

12. Shu-Sheng Chiang (24 out of 24 patents)

13. Ming-Hao Wu (23 out of 23 patents)

14. Shih-Lian Cheng (22 out of 22 patents)

15. Shao-Chien Lee (19 out of 19 patents)

Core Competencies:

Electronic Packaging

Circuit Board Structure

Chip Package

Probe Card

Multi-Layered Resonator

Integrated Circuit Package

Light-Emitting Diode Package

Flexible Circuit Board

Heat Dissipation Efficiency

Substrate Structure

Circuit Assembly

Signal Enhancement

499 patents: Sort by Forward Citations

1. 12506056 - Electronic package structure and manufacturing method thereof (2025-12-23),

2. 12504591 - Co-packaged structure for optics and electrics (2025-12-23),

3. 12469769 - Electronic packaging structure and manufacturing method thereof (2025-11-11),

4. 12439529 - Plurality of build-up layers in a circuit board structure (2025-10-07),

5. 12438060 - Chip package and method of manufacturing the same (2025-10-07),

6. 12426168 - Circuit board structure and method for forming the same (2025-09-23),

7. 12422456 - Probe card (2025-09-23),

8. 12414243 - Manufacturing method of package structure (2025-09-09),

9. 12414235 - Circuit board structure and manufacturing method thereof (2025-09-09),

10. 12412879 - Package structure and manufacturing method thereof (2025-09-09),

11. 12396100 - Circuit board structure and manufacturing method thereof (2025-08-19),

12. 12396095 - Circuit board with low grain boundary density and forming method thereof (2025-08-19),

13. 12369250 - Circuit board structure and manufacturing method thereof (2025-07-22),

14. 12347912 - Multi-layered resonator circuit structure and multi-layered filter circuit structure (2025-07-01),

15. 12328828 - Method for manufacturing circuit board (2025-06-10),

Unimicron Technology Corporation is a Taiwanese electronic component manufacturing company. It specializes in the production of printed circuit boards (PCBs) for various industries including telecommunications, automotive, consumer electronics, and more. With over 30 years of experience, Unimicron is known for its advanced technologies, excellent quality control, and efficient production processes. The company is committed to delivering reliable and innovative PCB solutions to meet the evolving needs of its customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

499 Patents

#6 in Taoyuan

#57 in Taiwan

#1,885 in the World

Taoyuan, Taiwan

Unimicron Technology Corporation

Forward Citations = 1,129

302 inventors:

Tzyy-Jang Tseng (88 out of 91 patents)

Cheng-Ta Ko (46 out of 57 patents)

Cheng-Po Yu (39 out of 40 patents)

4. Pu-Ju Lin (37 out of 37 patents)

5. Kai-Ming Yang (35 out of 36 patents)

Please report any incorrect information to support@idiyas.com

Loading…