The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
May. 13, 2024
Unimicron Technology Corp., Taoyuan City, TW;
Chia-Yu Peng, Taoyuan City, TW;
Kai-Ming Yang, Taoyuan City, TW;
Pu-Ju Lin, Taoyuan City, TW;
Cheng-Ta Ko, Taoyuan City, TW;
UNIMICRON TECHNOLOGY CORP., Taoyuan City, TW;
Abstract
A collapse-free circuit structure with low capacitance effect includes a circuit layer that is layered between a connection layer and a bottom circuit layer. A pad and an upper circuit of the connection layer are spaced with an upper gap for electrical insulation. The bottom circuit layer includes a bottom circuit and a pad supporting structure, wherein the pad supporting structure is located right below the pad. The pad supporting structure and the bottom circuit are spaced with a bottom gap for electrical insulation. The circuit layer includes a circuit layer dielectric, wherein the circuit layer dielectric is located between the pad and the pad supporting structure. The existence of the upper gap and the bottom gap ensures low capacitance effect between the connection layer and the bottom circuit layer. The pad supporting structure prevents the pad from collapsing.