Taoyuan, Taiwan

Kai-ming Yang

This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignee: Unimicron Technology Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kai-ming Yang. Retrieved from https://idiyas.com/inventor/kai-ming-yang-w2pogif6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Kai-ming Yang: Circuit Board and Low-Capacitance Circuit Innovations.

Introduction

Kai-ming Yang is an inventor based in Taoyuan, Taiwan. His work focuses on circuit-board structures and manufacturing methods, including designs intended to support reliable electrical connections and reduce capacitance. He is associated with Unimicron Technology Corporation and holds 2 patents.

Latest Patents

Yang’s listed patents address circuit-board fabrication and circuit structures.

- **Circuit board structure and manufacturing method thereof.** This invention describes a process that begins with a temporary substrate and forms a dielectric layer with at least one through hole. A surface treatment layer and pad are formed in the hole, followed by a built-up structure on the dielectric layer. After the built-up structure is assembled to a substrate, the temporary substrate and dielectric layer are removed.

- **Collapse-free circuit structure with low capacitance effect.** This design places a circuit layer between a connection layer and a bottom circuit layer. Gaps electrically isolate the pad from the upper circuit and the pad-supporting structure from the bottom circuit, helping reduce capacitance between the connection and bottom circuit layers. The supporting structure beneath the pad is designed to prevent the pad from collapsing.

Career Highlights

Yang’s patent work reflects an emphasis on circuit-board construction, manufacturing processes, and structural features that address electrical performance and mechanical support. His listed inventions cover both a fabrication sequence for a circuit-board structure and a circuit design intended to combine low capacitance with pad stability.

Collaborations

Yang is associated with Unimicron Technology Corporation. His listed coworkers include Pu-ju Lin and Cheng-ta Ko.

Conclusion

Kai-ming Yang’s two listed patents highlight his contributions to circuit-board manufacturing and circuit structures designed to reduce capacitance while supporting pad stability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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