The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

May. 20, 2024
Applicant:

Unimicron Technology Corp., Taoyuan City, TW;

Inventors:

Chin-Sheng Wang, Taoyuan City, TW;

Chen-Hao Lin, Taoyuan City, TW;

Ansheng Lee, Taoyuan City, TW;

Kai-Ming Yang, Taoyuan City, TW;

Pu-Ju Lin, Taoyuan City, TW;

Cheng-Ta Ko, Taoyuan City, TW;

Assignee:

UNIMICRON TECHNOLOGY CORP., Taoyuan City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 1/111 (2013.01); H05K 2201/099 (2013.01);
Abstract

A circuit board structure and a manufacturing method thereof. The method includes: providing a temporary substrate; forming a dielectric layer having at least one through hole on the temporary substrate; forming a surface treatment layer on the temporary substrate in the at least one through hole; forming at least one pad on the surface treatment layer; forming a built-up structure on the dielectric layer; assembling the built-up structure to a substrate; removing the temporary substrate; and removing the dielectric layer.


Find Patent Forward Citations

Wang, Chin-Sheng. (2026). Circuit board structure and manufacturing method thereof (U.S. Patent No. 12757334). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757334

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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