Cheng-ta Ko

Title: Cheng-ta Ko: Innovator in Anti-Diffusion Substrate Technology

Introduction

Cheng-ta Ko is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of substrate technology, particularly with his innovative patent that addresses material diffusion issues in electronic components. His work is essential for enhancing the reliability and performance of electronic devices.

Latest Patents

Cheng-ta Ko holds a patent for an "Anti-diffusion substrate structure and manufacturing method thereof." This invention features a substrate with multiple through holes, each containing a first metal layer and an anti-diffusion layer. The anti-diffusion layer can be either an Electroless Palladium Immersion Gold (EPIG) layer or an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) layer. The substrate circuit layer, made of a second metal layer, is mounted on the substrate and extends over the anti-diffusion layer. This design effectively prevents the migration of materials from the first metal layer to the second metal layer, thereby improving the overall performance of electronic components.

Career Highlights

Cheng-ta Ko is currently employed at Unimicron Technology Corporation, where he continues to develop innovative solutions in substrate technology. His expertise and dedication to research have positioned him as a key figure in his field. With a total of 1 patent, he has demonstrated his ability to create impactful inventions that address real-world challenges in electronics.

Collaborations

Cheng-ta Ko has collaborated with talented coworkers such as Wei Tse Ho and Yi Ling Chen. Their combined efforts contribute to the advancement of technology within their organization.

Conclusion

Cheng-ta Ko's work in anti-diffusion substrate technology showcases his innovative spirit and commitment to improving electronic components. His contributions are vital for the ongoing development of reliable and efficient electronic devices.