The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Jan. 04, 2024
Unimicron Technology Corp., Taoyuan City, TW;
Chin-Sheng Wang, Taoyuan City, TW;
Ra-Min Tain, Hsinchu County, TW;
Chih-Kai Chan, Taoyuan City, TW;
Shih-Lian Cheng, New Taipei City, TW;
Unimicron Technology Corp., Taoyuan City, TW;
Abstract
A circuit board structure includes a core layer, at least one electroplating metal layer, at least one dielectric layer and at least one conductive metal layer. The core layer includes at least one dielectric portion and at least one metal portion. The electroplating metal layer is disposed on at least one of a first surface and a second surface of the core layer, exposing a portion of at least one of the first surface and the second surface and at least connecting the at least one metal part. The dielectric layer is disposed on at least one of the first surface and the second surface and on the electroplating metal layer. The dielectric layer has at least one opening exposing a portion of the electroplating metal layer. The conductive metal layer is disposed in the opening of the dielectric layer and is correspondingly connected to the electroplating metal layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile