IDiyas

For the Inventor, By the Inventor

Hsinchu, Taiwan

Dyi-Chung Hu

USPTO Granted Patents = 107 

 

Average Co-Inventor Count = 1.3

ph-index = 10

Forward Citations = 351(Granted Patents)


Inventors with similar research interests:


Location History:

  • Shuang-Shi, TW (1995)
  • Hsinchu Hsien, TW (2002)
  • Chutung Township, Hsinchu County, TW (2011)
  • Chutung, TW (2014 - 2017)
  • Zhudong Township, Hsinchu County, TW (2017 - 2019)
  • Taoyuan, TW (2012 - 2020)
  • Hsinchu County, TW (2012 - 2023)
  • Hsinchu, TW (2002 - 2024)

Company Filing History:

goldMedal31 out of 497 
 
Unimicron Technology Corporation
 patents
silverMedal7 out of 9,138 
 
Industrial Technology Research Institute
 patents
bronzeMedal2 out of 7 
 
Adl Engineering Inc.
 patents
4. 1 out of 37 
 
Advanced Chip Engineering Technology, Inc.
 patents
5. 1 out of 648 
 
Hannstar Display Corporation
 patents
6. 1 out of 1 
 
Advanced Clip Engineering Technology Inc.
 patent
7. 59 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1995-2025

Loading Chart...
Loading Chart...
107 patents (USPTO):
1. 12249567 - Manufacturing method of integrated substrate structure (2025-03-11),
2. 12210053 - Semiconductor device (2025-01-28),
3. 12198993 - Manufacturing method of circuit carrier with chip mounted thereon (2025-01-14),
4. 12176277 - Package substrate and package structure (2024-12-24),
5. 12014934 - Semiconductor substrate structure and manufacturing method thereof (2024-06-18),
6. 12009329 - Manufacturing method of integrated substrate (2024-06-11),
7. 11984403 - Integrated substrate structure, redistribution structure, and manufacturing method thereof (2024-05-14),
8. 11948899 - Semiconductor substrate structure and manufacturing method thereof (2024-04-02),
9. 11876291 - Millimeter-wave antenna module package structure and manufacturing method thereof (2024-01-16),
10. 11862545 - Integrated substrate structure, electronic assembly, and manufacturing method thereof (2024-01-02),
11. 11791256 - Package substrate and method of fabricating the same (2023-10-17),
12. 11567122 - Semiconductor device and manufacturing method thereof (2023-01-31),
13. 11404335 - Manufacturing method of carrier for semiconductor chip mounting thereon (2022-08-02),
14. 11309252 - Package substrate and package structure (2022-04-19),
15. 11125781 - Integrated substrate and manufacturing method thereof (2021-09-21),

Title: The Innovative Journey of Dyi-Chung Hu

Introduction:

Dyi-Chung Hu, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology and innovation through his groundbreaking inventions and patents.

Latest Patents:

Dyi-Chung Hu's latest patents include cutting-edge technologies in the semiconductor industry, particularly focusing on advancements in nanotechnology and microelectronics.

Career Highlights:

With a career spanning over two decades, Dyi-Chung Hu has held key roles in leading tech companies, driving research and development efforts that have resulted in numerous patented inventions. His expertise in semiconductor physics and engineering has led to the development of revolutionary technologies that have shaped the industry.

Collaborations:

Throughout his career, Dyi-Chung Hu has collaborated with top research institutions and universities worldwide, fostering a culture of innovation and knowledge sharing. His partnerships have been instrumental in pushing the boundaries of technological advancements and bringing cutting-edge solutions to the market.

Conclusion:

In conclusion, Dyi-Chung Hu stands as a visionary inventor whose relentless pursuit of innovation has left an indelible mark on the tech industry. His passion for pushing the boundaries of what is possible continues to inspire future generations of inventors and innovators.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…