San Diego, CA, United States of America

Hong Bok We

USPTO Granted Patents = 80 

 

 

Average Co-Inventor Count = 3.4

ph-index = 8

Forward Citations = 342(Granted Patents)

DiyaCoin DiyaCoin 0.87 


Inventors with similar research interests:


Company Filing History:


Years Active: 2016-2025

where 'Filed Patents' based on already Granted Patents

80 patents (USPTO):

Title: The Innovative Mind of Hong Bok We

Introduction

Hong Bok We, based in San Diego, California, is a prolific inventor with an impressive portfolio of 77 patents. His work primarily focuses on advanced integrated circuit (IC) packaging technologies that aim to enhance the performance and efficiency of electronic components.

Latest Patents

Among his latest innovations, one notable patent is the "Recess structure for padless stack via." This invention describes a novel stack via structure, where multiple vias are arranged over each other without the need for capture pads. This design enhances the contact area between the vias, improving overall performance. Another recent patent led by We is the "Integrated circuit (IC) package employing added metal for embedded metal traces in an ETS-based substrate for reduced signal path impedance." This patent addresses the challenge of increased impedance in longer signal paths, implementing added metal interconnects to optimize embedded metal traces within the ETS metallization layer. Such advancements significantly mitigate signaling delay and loss, thus enhancing the efficiency of IC packages.

Career Highlights

Hong Bok We has made significant contributions to the technology industry, particularly during his tenure at Qualcomm Incorporated. His experience and inventive spirit have positioned him as a leading figure in the development of cutting-edge electronic packaging solutions.

Collaborations

Throughout his career, We has collaborated with talented individuals, including Aniket Patil and Dong Wook Kim. These partnerships have fostered an environment of creativity and innovation, allowing for the successful development of several patented technologies.

Conclusion

Hong Bok We represents the epitome of innovation within the electronics sector. With 77 patents to his name and continuous advancements in integrated circuit technology, his contributions are shaping the future of electronic devices. As he continues to push the boundaries of technology, We’s work remains influential in enhancing electronic performance and efficiency.

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