The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Jun. 29, 2022
Qualcomm Incorporated, San Diego, CA (US);
Aniket Patil, San Diego, CA (US);
Hong Bok We, San Diego, CA (US);
Joan Rey Villarba Buot, Escondido, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods. The IC package includes a first semiconductor die ('first die') and a first electronic device each coupled to a package substrate. To provide signal routing paths between the first die and the first electronic device, the IC package includes a wire bond channel that includes wire bonds coupled between first and second metal pads coupled to the respective first die and first electronic device to provide signal routing paths between the first die and first electronic device. The wire bonds extend outside of the package substrate in a vertical direction. The wire bond channel may be able to support more direct signal routing paths between the first die and the first electronic device without having to route such signal routing paths around a KoZ in the package substrate.