The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Mar. 01, 2022
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Kuiwon Kang, San Diego, CA (US);
Hong Bok We, San Diego, CA (US);
Michelle Yejin Kim, San Diego, CA (US);
Assignee:
QUALCOMM INCORPORATED, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01);
Abstract
A package that includes a substrate, a first integrated device coupled to the substrate, and a second integrated device coupled to the substrate. The substrate includes at least one dielectric layer, and a plurality of interconnects comprising a plurality of escape interconnects. The plurality of escape interconnects includes a first embedded escape interconnect, a second embedded escape interconnect, and a third escape interconnect located between the first embedded escape interconnect and the second embedded escape interconnect.