IDiyas

For the Inventor, By the Inventor

San Diego, CA, United States of America

Kuiwon Kang

USPTO Granted Patents = 28 

 

Average Co-Inventor Count = 3.5

ph-index = 1

Forward Citations = 14(Granted Patents)


Location History:

  • Seoul, KR (2016 - 2017)
  • San Diego, CA (US) (2018 - 2023)

Company Filing History:

goldMedal28 out of 41,326 
 
Qualcomm Incorporated
 patents

Years Active: 2016-2025

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28 patents (USPTO):
1. 12424559 - Package with a substrate comprising embedded escape interconnects and surface escape interconnects (2025-09-23),
2. 12362269 - Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods (2025-07-15),
3. 12354935 - Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods (2025-07-08),
4. 11791320 - Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods (2023-10-17),
5. 11776888 - Package with a substrate comprising protruding pad interconnects (2023-10-03),
6. 11764076 - Semi-embedded trace structure with partially buried traces (2023-09-19),
7. 11676905 - Integrated circuit (IC) package with stacked die wire bond connections, and related methods (2023-06-13),
8. 11637057 - Uniform via pad structure having covered traces between partially covered pads (2023-04-25),
9. 11605595 - Packages with local high-density routing region embedded within an insulating layer (2023-03-14),
10. 11552023 - Passive component embedded in an embedded trace substrate (ETS) (2023-01-10),
11. 11552015 - Substrate comprising a high-density interconnect portion embedded in a core layer (2023-01-10),
12. 11545439 - Package comprising an integrated device coupled to a substrate through a cavity (2023-01-03),
13. 11545435 - Double sided embedded trace substrate (2023-01-03),
14. 11527498 - Bump pad structure (2022-12-13),
15. 11444019 - Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package (2022-09-13),

Title: Inventor Kuiwon Kang

Introduction: Kuiwon Kang is a talented inventor based in San Diego, CA, known for his innovative contributions to various fields.

Latest Patents: Kuiwon Kang holds several patents in the areas of technology and healthcare, showcasing his diverse range of expertise.

Career Highlights: With a background in engineering and a passion for problem-solving, Kang has successfully developed groundbreaking solutions that have made a significant impact in the industry.

Collaborations: Throughout his career, Kuiwon Kang has collaborated with leading researchers, engineers, and companies to bring his inventions to life, fostering a culture of innovation and excellence.

Conclusion: Inventor Kuiwon Kang's dedication to pushing the boundaries of technology and his commitment to creating meaningful change make him a standout figure in the world of inventions.

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