Kuiwon Kang

This inventor holds 33 USPTO granted patents and 36 published patent applications and 8 EPO patents, primarily in Integrated Circuit Packaging. Top assignee: Qualcomm Incorporated. Active years: 2016-2026.

USPTO Granted Patents = 33 (Patent Applications = 36)

% Patents Active = 87.9

EPO Patents = 8 (Patent Applications = 35)

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 15(Granted Patents)

Location History:

Seoul, KR (2016 - 2017)
San Diego, CA (US) (2018 - 2023)

Company Filing History:

33 out of 44,679

Qualcomm Incorporated

patents

Years Active: 2016-2026

Loading Chart...

Areas of Expertise:

Embedded Trace Substrate

Integrated Circuit Package

Thermal Management

High-Density Interconnects

Electronic Component

Interconnect Routing

Die Stacking

Thermal Conductive Substrate

Metal Core

Passive Component

Bump Pad Structure

Ground Shield Plane

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12648465 - Embedded trace substrates (ETSs) with T-shaped interconnects with reduced-width embedded metal traces, and related integrated circuit (IC) packages and fabrication methods (2026-06-02),

2. 12610869 - Integrated circuit (IC) package employing a metal block with metal interconnects thermally coupling a die to an interposer substrate for dissipating thermal energy of the die, and related fabrication methods (2026-04-21),

3. 12593408 - Package substrate having embedded electronic component in a core of the package substrate (2026-03-31),

4. 12581966 - Electronic component placed on core of substrate (2026-03-17),

5. 12500146 - Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methods (2025-12-16),

6. 12424559 - Package with a substrate comprising embedded escape interconnects and surface escape interconnects (2025-09-23),

7. 12362269 - Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods (2025-07-15),

8. 12354935 - Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods (2025-07-08),

9. 11791320 - Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods (2023-10-17),

10. 11776888 - Package with a substrate comprising protruding pad interconnects (2023-10-03),

11. 11764076 - Semi-embedded trace structure with partially buried traces (2023-09-19),

12. 11676905 - Integrated circuit (IC) package with stacked die wire bond connections, and related methods (2023-06-13),

13. 11637057 - Uniform via pad structure having covered traces between partially covered pads (2023-04-25),

14. 11605595 - Packages with local high-density routing region embedded within an insulating layer (2023-03-14),

15. 11552023 - Passive component embedded in an embedded trace substrate (ETS) (2023-01-10),

Title: Inventor Kuiwon Kang

Introduction: Kuiwon Kang is a talented inventor based in San Diego, CA, known for his innovative contributions to various fields.

Latest Patents: Kuiwon Kang holds several patents in the areas of technology and healthcare, showcasing his diverse range of expertise.

Career Highlights: With a background in engineering and a passion for problem-solving, Kang has successfully developed groundbreaking solutions that have made a significant impact in the industry.

Collaborations: Throughout his career, Kuiwon Kang has collaborated with leading researchers, engineers, and companies to bring his inventions to life, fostering a culture of innovation and excellence.

Conclusion: Inventor Kuiwon Kang's dedication to pushing the boundaries of technology and his commitment to creating meaningful change make him a standout figure in the world of inventions.