The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

May. 01, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Omar James Bchir, San Marcos, CA (US);

Dongming He, San Diego, CA (US);

Ryan Lane, San Diego, CA (US);

Kuiwon Kang, San Diego, CA (US);

Lily Zhao, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/685 (2026.01); H10B 80/00 (2023.01); H10W 20/20 (2026.01); H10W 70/05 (2026.01); H10W 70/68 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 70/09 (2026.01); H10W 70/652 (2026.01);
U.S. Cl.
CPC ...
H10W 70/685 (2026.01); H10B 80/00 (2023.02); H10W 20/20 (2026.01); H10W 70/05 (2026.01); H10W 70/68 (2026.01); H10W 74/019 (2026.01); H10W 74/117 (2026.01); H10W 90/00 (2026.01); H10W 70/09 (2026.01); H10W 70/6528 (2026.01); H10W 90/736 (2026.01); H10W 90/738 (2026.01);
Abstract

Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods are also disclosed. The cavity of the core (that has one or more core layers) of the substrate includes an embedded electrical device structure that an electrical device built upon another second component(s) to make the overall height of the electrical device structure compatible with the height of the cavity of the core. In this manner, the design criteria used to select thickness or height of the core for providing the desired stability in the substrate can be incompatible with the thickness or the height of the embedded electrical device.


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