IDiyas

For the Inventor, By the Inventor

San Marcos, CA, United States of America

Omar James Bchir

USPTO Granted Patents = 40 

 

Average Co-Inventor Count = 2.5

ph-index = 6

Forward Citations = 119(Granted Patents)


Location History:

  • Chandler, AZ (US) (2008 - 2012)
  • Phoenix, AZ (US) (2009 - 2013)
  • San Diego, CA (US) (2013 - 2016)
  • San Marcos, CA (US) (2014 - 2022)

Company Filing History:

goldMedal18 out of 41,326 
 
Qualcomm Incorporated
 patents
silverMedal14 out of 54,664 
 
Intel Corporation
 patents
bronzeMedal4 out of 37,905 
 
Micron Technology Incorporated
 patents
4. 2 out of 180 
 
Rockley Photonics Limited
 patents
5. 1 out of 18 
 
Obsidian Sensors, Inc.
 patents
6. 1 out of 832,680 
Other
 patents

Years Active: 2008-2025

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40 patents (USPTO):
1. 12453210 - Optoelectronic module package (2025-10-21),
2. 12300680 - Semiconductor packages having photon integrated circuit (PIC) chips (2025-05-13),
3. 11525956 - Semiconductor devices having electro-optical substrates (2022-12-13),
4. 11239377 - Optoelectronic module package (2022-02-01),
5. 11024617 - Semiconductor packages having photon integrated circuit (PIC) chips (2021-06-01),
6. 10928585 - Semiconductor devices having electro-optical substrates (2021-02-23),
7. 10199152 - Embedded thin film magnetic carrier for integrated voltage regulator (2019-02-05),
8. 10150667 - Panel level packaging for MEMS application (2018-12-11),
9. 9929097 - Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers (2018-03-27),
10. 9806063 - Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability (2017-10-31),
11. 9679841 - Substrate and method of forming the same (2017-06-13),
12. 9642259 - Embedded bridge structure in a substrate (2017-05-02),
13. 9609751 - Package substrate comprising surface interconnect and cavity comprising electroless fill (2017-03-28),
14. 9601435 - Semiconductor package with embedded components and method of making the same (2017-03-21),
15. 9484327 - Package-on-package structure with reduced height (2016-11-01),

Title: The Innovative Journey of Omar James Bchir

Introduction: Omar James Bchir, a visionary inventor based in San Marcos, CA (US), has made significant contributions to the field of technology with his groundbreaking inventions and creative solutions.

Latest Patents: Omar James Bchir holds several patents in various technological domains, including artificial intelligence, renewable energy, and medical devices. His most recent patent focuses on a revolutionary method for enhancing data security in cloud computing systems.

Career Highlights: With a background in computer science and engineering, Omar James Bchir has a successful track record of developing cutting-edge technologies that have reshaped industries. His innovative approach to problem-solving has led to the creation of products that improve efficiency and effectiveness in diverse sectors.

Collaborations: Throughout his career, Omar James Bchir has collaborated with leading research institutions, tech companies, and universities to further advance his inventions. His ability to work in multidisciplinary teams has resulted in the successful implementation of complex technological solutions.

Conclusion: Omar James Bchir's passion for innovation and his dedication to pushing the boundaries of technology have established him as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators to think outside the box and create solutions that have a lasting impact on society.

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