The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
May. 22, 2015
Applicants:
Ravi Nalla, San Jose, CA (US);
Omar Bchir, San Marcos, CA (US);
Houssam Jomaa, San Diego, CA (US);
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); C08J 5/18 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); C08J 5/18 (2013.01); H01L 24/26 (2013.01); H05K 1/0298 (2013.01); H05K 3/381 (2013.01); H05K 3/4661 (2013.01); C08J 2363/00 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H05K 3/181 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01); H05K 2203/0773 (2013.01); H05K 2203/0796 (2013.01); Y10T 156/1052 (2015.01); Y10T 428/249921 (2015.04); Y10T 428/254 (2015.01); Y10T 428/268 (2015.01);
Abstract
In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.