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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Houssam Jomaa

USPTO Granted Patents = 33 


Average Co-Inventor Count = 2.6

ph-index = 6

Forward Citations = 154(Granted Patents)


Location History:

  • Chandler, AZ (US) (2009 - 2012)
  • San Diego, CA (US) (2014 - 2020)
  • Phoenix, AZ (US) (2009 - 2021)

Company Filing History:

goldMedal21 out of 54,750 
 
Intel Corporation
 patents
silverMedal11 out of 41,498 
 
Qualcomm Incorporated
 patents
bronzeMedal1 out of 832,843 
Other
 patents

Years Active: 2009-2021

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33 patents (USPTO):Explore Patents
1. 11107766 - Substrate with embedded stacked through-silicon via die (2021-08-31),
2. 10804195 - High density embedded interconnects in substrate (2020-10-13),
3. 10651160 - Low profile integrated package (2020-05-12),
4. 10622292 - High density interconnects in an embedded trace substrate (ETS) comprising a core layer (2020-04-14),
5. 10461032 - Substrate with embedded stacked through-silicon via die (2019-10-29),
6. 10157824 - Integrated circuit (IC) package and package substrate comprising stacked vias (2018-12-18),
7. 9941158 - Integrated circuit and process for fabricating thereof (2018-04-10),
8. 9929097 - Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers (2018-03-27),
9. 9679841 - Substrate and method of forming the same (2017-06-13),
10. 9609751 - Package substrate comprising surface interconnect and cavity comprising electroless fill (2017-03-28),
11. 9559088 - Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same (2017-01-31),
12. 9536805 - Power management integrated circuit (PMIC) integration into a processor package (2017-01-03),
13. 9460980 - Systems, apparatus, and methods for heat dissipation (2016-10-04),
14. 9398699 - Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same (2016-07-19),
15. 9355898 - Package on package (PoP) integrated device comprising a plurality of solder resist layers (2016-05-31),

Title: The Innovative Legacy of Inventor Houssam Jomaa

Introduction:

Houssam Jomaa, a pioneering inventor based in Phoenix, AZ, has left an indelible mark on various industries through his prolific contributions to technological advancements. With a total of 33 patents under his belt, Jomaa's dedication to innovation has reshaped the landscape of modern inventions.

Latest Patents:

Among his recent patents is the groundbreaking "Substrate with Embedded Stacked Through-Silicon Via Die," illustrating his expertise in integrating advanced technologies into substrates. Additionally, the "High-Density Embedded Interconnects in Substrate" patent highlights his ingenuity in developing devices with intricate embedded interconnects.

Career Highlights:

With a notable career trajectory, Houssam Jomaa has worked with esteemed companies such as Intel Corporation and Qualcomm Incorporated. His tenure at these tech giants has provided him with invaluable experience and resources to fuel his inventive spirit.

Collaborations:

Throughout his professional journey, Jomaa has collaborated with exceptional individuals like Omar James Bchir and Islam A Salama, further enriching his innovative projects with diverse perspectives and expertise. These collaborations have led to the creation of groundbreaking technologies that push the boundaries of what is possible.

Conclusion:

In conclusion, Houssam Jomaa stands out as a visionary inventor whose relentless pursuit of innovation has paved the way for transformative advancements in various industries. His remarkable skill set, coupled with a passion for creating a better future through technology, solidifies his position as a trailblazer in the world of inventors.

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