The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Nov. 13, 2018
Qualcomm Incorporated, San Diego, CA (US);
Kuiwon Kang, San Diego, CA (US);
Houssam Jomaa, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A substrate that includes a first substrate portion, a second substrate portion and a second dielectric layer. The first substrate portion includes a core layer having a first core surface, and a plurality of core substrate interconnects, wherein the plurality of core substrate interconnects includes a plurality of surface core substrate interconnects formed over the first surface of core layer. The second substrate portion includes a first dielectric layer having a first dielectric surface, the first dielectric surface facing the first core surface of the core layer, and a plurality of substrate interconnects, wherein the plurality of substrate interconnects includes a plurality of interconnects formed over the first dielectric surface. The second dielectric layer is formed between the first substrate portion and the second substrate portion such that the plurality of surface core substrate interconnects and the plurality of substrate interconnects are located in the second dielectric layer.