The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
May. 15, 2014
Applicants:
Javier Soto Gonzalez, Chandler, AZ (US);
Houssam Jomaa, Phoenix, AZ (US);
Inventors:
Javier Soto Gonzalez, Chandler, AZ (US);
Houssam Jomaa, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/95 (2013.01); H01L 21/568 (2013.01); H01L 23/49816 (2013.01); H01L 24/20 (2013.01); H01L 24/25 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/19 (2013.01); H01L 2224/221 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/251 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82005 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/95 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18162 (2013.01);
Abstract
An apparatus includes a substrate having a land side having a plurality of contact pads and a die side opposite the land side. The apparatus includes a first die and a second die wherein the first die and second die are embedded within the substrate such that the second die is located between the first die and the land side of the substrate.