The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Aug. 27, 2012
Applicants:
Houssam Jomaa, Phoenix, AZ (US);
Omar Bchir, San Diego, CA (US);
Inventors:
Houssam Jomaa, Phoenix, AZ (US);
Omar Bchir, San Diego, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/28 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/28 (2013.01); H01L 21/4853 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 21/563 (2013.01); H01L 23/5387 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/15311 (2013.01); H05K 1/189 (2013.01); H05K 3/0035 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/099 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49128 (2015.01); Y10T 29/49147 (2015.01); Y10T 29/49153 (2015.01); Y10T 29/49165 (2015.01); Y10T 29/49169 (2015.01);
Abstract
A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.